Effect of h-BN and Nano-SiO2 Fillers on the High-Temperature Tribological Properties of PEEK/PI-Based Composites

PEEK is being used increasingly often in seals, bushings, bearings, and other moving parts due to its excellent mechanical tribological properties. Herein, PEEK-based composites were prepared using PI as the organic filler h-BN nano-SiO2 particles inorganic fillers. There was significant improvement properties of at conditions above glass transition temperature; coefficient friction +20P/4B/4Si stabilized 0.06 200 °C wear rate reduced by 60% compared PEEK. The role played thermal conductivity promotion transfer film improving illustrated. modified exhibited stable over a wide temperature range, which instructive for instrumentation testing applications harsh environments.